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Nuvo-5095GC
Compact and wide-temperature GPU Computing platform supporting 75W nVidia® GPU & Intel® 6th-Gen Core™ processor
- Supports nVidia® GPU with up to 75W TDP
- Patented thermal design to allow -25°C to 60°C wide temperature range operation
- Supports 6th-Gen Intel® Core™ i7/i5 LGA1151 CPU
- 6x Gigabit Ethenet ports
- Supports 9.5 kB jumbo frame
- Up to 32 GB, DDR4-2133 SODIMM
- 240 mm x 225 mm x 111 mm compact footprint
- Compatible with MezIO™ interface for function expansion
- Accommodates two 2.5" SATA HDD/SSD with RAID 0/1 support
- Patented ventilation hole* for graphic card
Free shipping from €300
Promocja cenowa na model HDR-15-5
Nuvo-5095GC
Description
Nuvo-5095GC opens a new chapter for industrial computers. As the first embedded controller targeted at emerging applications of CUDA computing, Autonomous, Edge AI inference and virtual reality, Nuvo-5095GC has all the features required for a compact, reliable and powerful edge AI GPU computing platform.
Supporting 75W nVidia® GPU, Nuvo-5095GC possesses 768 CUDA cores to deliver tremendous computing power for arithmetic/graphics operations. Neousys' patented Cassette technology and an innovative thermal design help to effectively dissipate heat generated by the GPU, thus making this compact system capable of operating reliably at 60°C under 100% GPU load.
Nuvo-5095GC is based on Intel® Skylake platform, supporting 35W/65W 6th-Gen ® Core™ processors and up to 32GB of DDR4 memory. It offers rich I/O functions, such as GbE, USB 3.1 Gen1 and COM ports to connect to external devices. All these features are integrated into a compact, 240 x 225 x 110 mm footprint. For fast-growing GPU-computing applications, Nuvo-5095GC presents the first industrial-grade, compact and rugged platform incorporating CPU and GPU to offer performances far beyond traditional industrial computers.
Technical Specification
| Processor | Supports 6th-Gen Intel® Core™ LGA1151 CPU - Intel® Core™ i7-6700 (8M Cache,3.4/4.0 GHz, 65W TDP) - Intel® Core™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP) - Intel® Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP) - Intel® Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP) |
|---|---|
| Chipset | Intel® Q170 Platform Controller Hub |
| Graphics | Independent nVidia® GPU (75W TDP) or Integrated Intel® HD 530/510 Controller |
| Memory | Up to 32 GB DDR4 2666/ 2400 SDRAM (two SODIMM slots) |
| AMT | Supports AMT 11.0 |
| TPM | Supports TPM 2.0 |
| Ethernet Port | 6x Gigabit Ethernet ports by 1x I219 and 5x I210 |
| POE+ | Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 80 W total power budget |
| USB | 4x USB 3.1 Gen1 ports via native XHCI controller 4x USB 2.0 ports |
| Video Port | 1x VGA , supporting 1920 x 1200 resolution 1x DVI-D, supporting 1920 x 1200 resolution 2x DisplayPort, supporting 4096 x 2304 resolution |
| Serial Port | 2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| PCI/PCI Express | N/A |
| Mini PCI-E | 1x internal mini PCI Express socket with front-accessible SIM socket 1x internal mini PCI Express socket with internal SIM socket (mux with mSATA) |
| M.2 | N/A |
| Expandable I/O | 1x MezIO™ expansion port for Neousys MezIO™ modules |
| SATA HDD | 2x internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/ 1 |
| M.2 | N/A |
| mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
| DC Input | 1x 3-pin pluggable terminal block for 8V to 35V DC input |
| Remote Ctrl. & LED Output | 1x 3-pin pluggable terminal block for remote control and PWR LED output |
| Dimension | 240 mm (W) x 225 mm (D) x 111 mm (H) |
| Weight | 4.5 kg |
| Mounting | Wall-mounting |
| Operating temperature | with i7-6700TE, i5-6500TE (35W TDP) -25°C ~ 60°C ** with i7-6700, i5-6500 (65W TDP) -25°C ~ 60°C **/*** (configured as 35W CPU mode) -25°C ~ 50°C **/*** (configured as 65W CPU mode) |
| Storage temperature | -40°C ~ 85°C |
| Humidity | 10% ~ 90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
** The high operating temperature specified here is defined under the condition of 100% GPU loading applied using TessMark x64 GPU stress test. For detail testing criteria, please contact Neousys Technology
***For sub-zero operating temperature, a wide temperature range HDD drive or Solid State Disk (SSD) is required.
