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Nuvo-5026E

Intel® 6th-Gen Core™ i7/i5/i3 fanless rugged embedded computer with dual PCIe expansion cassette, 6x GbE & MezIO™ interface

Manufacturer: Neousys Technology
Manufacturer: Neousys Technology
  • Intel® 6th Gen Core™ i7/ i5/ i3 LGA1151 35W/ 65W
  • Dual PCIe x8 slots in patented expansion Cassette*
  • MezIO™ interface for easy function expansion
  • Rugged, wide temperature range from -25°C to 70°C fanless operation
  • 6x GbE ports, supporting 9.5 KB jumbo frame
  • Up to 32 GB, DDR4-2133 SODIMM
  • Accommodates two 2.5" SATA HDD/ SSD with RAID 0/1 support
  • VGA/ DVI/ DP triple independent display, supporting 4K2K resolution
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Description

Nuvo-5026E fanless embedded computer is the latest Nuvo-5000 family member with dual PCIe slots. The dual PCIe slots enhance expansion abilities while preserving all practical features such as ruggedness, performance and versatility.

The expandability makes Nuvo-5026E more adaptable to various application needs while the two PCle slots in the patented expansion Cassette are easy to access for PCIe card installation without the need to disassemble the system.

Nuvo-5026E supports LGA1151 6th Gen Core™ processors. It offers processor selection flexibility from Core™ i7 to Celeron according to performance needs and operating environment. It also offers plenty of I/O functions such as 6x GbE, 4x USB 3.1 Gen1, 3x COM ports and triple independent display. In addition, Neousys' MezIO™ interface can also further expand system I/Os offering up to either 11x COM ports, 10x GbE, 8x USB 3.1 Gen1, 32x DIO or ignition power control by installing an optional MezIO™ module.

Nuvo-5026E is an expandable and flexible platform with numerous I/O functions for various industrial applications.

Technical Specification

 

Processor Intel® Core™ i7-6700 (8M Cache,3.4/ 4.0 GHz, 65W TDP)*
Intel® Core™ i5-6500 (6M Cache, 3.2/ 3.6 GHz, 65W TDP)*
Intel® Core™ i3-6100 (3M Cache, 3.7 GHz, 51W TDP)*
Intel® Pentium® G4400 (3M Cache, 3.3 GHz, 54W TDP)*
Intel® Celeron® G3900 (2M Cache, 2.8 GHz, 51W TDP)*
Intel® Core™ i7-6700TE (8M Cache, 2.4/ 3.4 GHz, 35W TDP)
Intel® Core™ i5-6500TE (6M Cache, 2.3/ 3.3 GHz, 35W TDP)
Intel® Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP)
Intel® Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP)
Intel® Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP)
Chipset Intel® Q170 Platform Controller Hub
Graphics Independent nVidia® GPU (75W TDP) or Integrated Intel® HD 530/510 Controller
Memory Up to 32 GB DDR4 2666/ 2400 SDRAM (two SODIMM slots)
AMT Supports AMT 11.0
TPM Supports TPM 2.0
Ethernet Port 6x Gigabit Ethernet ports by 1x I219 and 5x I210
POE+ Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6
80 W total power budget
USB 4x USB 3.1 Gen1 ports via native XHCI controller
4x USB 2.0 ports
Video Port 1x VGA , supporting 1920 x 1200 resolution
1x DVI-D, supporting 1920 x 1200 resolution
2x DisplayPort, supporting 4096 x 2304 resolution
Serial Port 2x software-programmable RS-232/422/485 ports (COM1/ COM2)
2x RS-232 ports (COM3/ COM4)
Audio 1x 3.5 mm jack for mic-in and speaker-out
PCI/PCI Express 2x PCIe x8 slot @ Gen3, 4-lanes PCIe signals in expansion Cassette
Mini PCI-E 1x internal mini PCI Express socket with front-accessible SIM socket
1x internal mini PCI Express socket with internal SIM socket (mux with mSATA)
M.2 N/A
Expandable I/O 1x MezIO™ expansion port for Neousys MezIO™ modules
SATA HDD 2x internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/ 1
M.2 N/A
mSATA 1x full-size mSATA port (mux with mini-PCIe)
DC Input 1x 3-pin pluggable terminal block for 8V to 35V DC input
Remote Ctrl. & LED Output 1x 3-pin pluggable terminal block for remote control and PWR LED output
Dimension 240 mm (W) x 225 mm (D) x 111 mm (H)
Weight 3.7 kg 
Mounting Wall-mounting 
Operating temperature with i7-6700TE, i5-6500TE, i3-6100TE, Pentium G4400TE(35W TDP)
-25°C ~ 70°C *

with i7-6700, i5-6500, i3-6100 (65W/51W TDP)
-25°C ~ 70°C */ ** (configured as 35W CPU mode)
-25°C ~ 50°C */ ** (configured as 65W/51W CPU mode)
Storage temperature -40°C ~ 85°C
Humidity 10% ~ 90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC CE/FCC Class A, according to EN 55032 & EN 55024

** The high operating temperature specified here is defined under the condition of 100% GPU loading applied using TessMark x64 GPU stress test. For detail testing criteria, please contact Neousys Technology
***For sub-zero operating temperature, a wide temperature range HDD drive or Solid State Disk (SSD) is required.